Ryzen 9 9950X3D & 9900X3D: Asus ROG China hints at launching dual-chiplet processors at CES 29 comments
The head of the Asus ROG division in China, Tony Yu, who was recently very busy during the presentation of the Intel Core Ultra 200S (test) and AMD Ryzen 7 9800X3D (test), recently brought new AM5 motherboards from the 800 series with rear connectors at CES have been promised – although “more powerful processors” than the 9800X3D are likely to appear.
Clearly vague statement in live stream
The corresponding statement was reportedly made during a live broadcast in China. Yu hasn’t officially confirmed that both dual-chiplet Ryzens with 3D V-Cache (with likely still a single chiplet with an additional L3 chip) will be shown in January, but the statement is another piece of the puzzle toward certainty.
Asus Back to the Future (BTF)
It’s easy for Yu to promise his own back-to-the-future (Asus BTF) motherboards with rear connectors: the chipsets are official, they are just new variants from Asus – which were not yet available at the start of the series at the end of September.
More details about Asus Back to the Future (BTF)
Since the Z890 motherboards with LGA 1851 for Intel Core Ultra 200S from Asus have not yet seen new BTF variants, this has already sparked speculation that the series will be discontinued. This is obviously not the case.
MSI and Gigabyte also offer motherboards with rear connectors, but only Asus has so far implemented the connection between the motherboard and the graphics card via graphics cards with a second dedicated contact strip. More and more case manufacturers are equipping their motherboard trays with recesses for new circuit boards.
Topics: AMD AMD Granite Ridge AMD Ryzen 9000 Asus CES CES 2025 Ryzen Processors
Marc deciphers processors by testing their performance for gaming, content creation, and artificial intelligence.
